Just a bit. Nice pics by the way.Quote:
Originally Posted by HiTechMike
What surprises me is that there were no goats involved.
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Just a bit. Nice pics by the way.Quote:
Originally Posted by HiTechMike
What surprises me is that there were no goats involved.
Prior to the development of much smaller processes (fiber embedded dies) dies were attached to the ceramic substrate via gold wire (pictured) some higher voltage or emf sensitive ICs were attached using platinum wire. Anyways, lithography of that time used gold as a layer in the process. The die would start as a semi conductor with a gold layer that would be etched into traces. A photosensitive chemical would then be flashed in pattern to create transistors and finally another coating would be applied to create the drains for the transistors. Even today a cpu die is probably worth multi thousands of dollars per lb...even though they are now fractions of grams each. P.S. nice dang haul there!