Originally Posted by
wdaddy
OK, where did someone talk about using a oscillating tool for this task? I guess I did miss that post. If you are talking about using a grinder to grind off the solder side of a board, that isn't at all what I was asking about. I wouldn't do that for low grade or even high grade components.
I don't think there would be any lead dust from an oscillating tool, you aren't cutting lead, you are cutting the little wire legs on components.
I still may try this. Or maybe try different ways to use the sawzall.
All you have to do is search for "lead dust" and you will find the threads. Here's one of them:
http://www.scrapmetalforum.com/showt...with-a-grinder.
There is solder on both sides of the pins. It really doesn't matter if you are grinding or sawing, you will kick up some lead dust. And it isn't just about you or me. It can get tracked into areas where other people, including children, may be present. Really, I just pull them off using a pair of pliers, a screwdriver, and maybe a pair of dikes. I have gotten fairly good at it and I'll bet I can get one off faster that way than if I was cutting or grinding.
I'm not an expert on lead dust and don't know if it is enough to be considered hazardous. But I do believe in "better safe than sorry." I also try to be responsible. Maybe I fail sometimes, but I try.
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